Pin Grid Array Sockets LIF & SUPERLIF ™ Low insertion and withdrawal force contacts Non-wicking closed bottom, precision sleeve protects 100% against flux and solder contamination Custom design capabilities molded plastic insulators Recognized under the Component Program of Underwriters Laboratories, Inc. File E111362 High temperature insulators allow the sockets to be soldered with vaporphase and infrared reflow soldering process

PPS Series

Pin Grid Array Sockets LIF & SUPERLIF ™ Low insertion and withdrawal force contacts Non-wicking closed bottom, precision sleeve protects 100% against flux and solder contamination Custom design capabilities Glass epoxy insulators Recognized under the Component Program of Underwriters Laboratories, Inc. File E111362 High temperature insulators allow the sockets to be soldered with vaporphase and infrared reflow soldering process

PIM/PIS Series

Pin Grid Array Sockets The socket includes the Thomas & Betts SUPERLIF ™ low insertion force 37 grams (1.3 oz.) contact Non-wicking closed bottom, precision sleeve protects 100% against flux and solder contamination Many footprint options available Custom design capabilities Available in molded plastic (PIM) and glass epoxy (PIS) insulators Integrally molded (PIM) heatsink mounting tabs available on some products High temperature insulators allow the sockets to be soldered with vaporphase and infrared reflow soldering process

IPGA Series

LIF Sockets Lever Actuated Zero insertion force contacts eliminate device and lead damage caused during insertion and withdrawal of traditional PGA sockets. Modified "V" Shaped contacts provide optimum normal force and our optimized dual beam contact system provides superior electrical and mechanical integrity to maximize reliability. Socket design incorporates an excellent balance of ergonomics and strength in a small outline package maximizing PCB real estate. Strong stainless steel actuating lever means lever will not break or bend from misuse like other type actuating handles. Available with open frame for allowing other PGA uses and providing easy access and processing of components located under the socket, saving PCB real estate. IPGA Foot Prints - (972k PDF File)

PKC Series

Pin Grid Array Sockets Low insertion and withdrawal force contacts Ultra low profile version only .040" (1,02) max. above P.C. board Socket will retain minimum component lead length With ultra-low sockets installed, circuit boards can be mounted on .400" (10,16) centerline spacing Maximizes air flow across pin grid device Carrier will withstand up to 400°C for application of vapor phase or infrared soldering Removable carrier improves cleaning and inspection of solder joints Insulator: High Temperature DuPont Kapton ® or equivalent PKC Carriers are always closed frame footprints.

ZIF Series

Pin Grid Array Sockets Lever Actuated Zero insertion force contacts eliminate device and lead damage caused during insertion and withdrawal of traditional PGA sockets. Modified "V" Shaped contacts provide optimum normal force and our optimized dual beam contact system provides superior electrical and mechanical integrity to maximize reliability. Socket design incorporates an excellent balance of ergonomics and strength in a small outline package maximizing PCB real estate. Strong stainless steel actuating lever means lever will not break or bend from misuse like other type actuating handles. Available with open frame for allowing other PGA uses and providing easy access and processing of components located under the socket, saving PCB real estate.