|
Product Links
|
|
Inside SRI
|
| SRI-Newsletter |
 |
Subscribe to our newsletter to receive monthly specials, manufacturer's feature, and electronics news via email. |
|
 |
|
See Our latest release of SRI-Newsletter here
|
|
View Our List of Archived Newsletter Articles
|
|
SRI Links
|
|
Visit our Sister Site,
Distributor of
Industrial Products
| |
|
Web Search ..
Powered by;
|
|
 |
|
|
|
|
|
 |
Application :
Low voltage USB equipment
Product Features : Low resistance, Fast trip time,
Lower Trip-to-hold Ratio
Operation current: 750mA ~2.5A
Maximum voltage: 16V
Temperature range: -40ºC to 85ºC
Agency Approvals:UL(E211981),C-UL(E211981), TÜV(R3-50004084)
|
|
Electrical
Characteristics(23ºC)
|
PartNumber |
Hold
Current |
Trip
Current |
Max.Time
to Trip |
Rated
Voltage |
Maximum
Current |
Typical
Power |
Resistance Tolerance |
|
RMIN |
R1MAX |
|
IH,A |
IT,A |
at
8A |
at 5xIH |
VMAX,V |
IMAX,A |
Pd,
W |
Ω |
Ω |
| FUSB075 |
0.75 |
1.30 |
0.4 |
-- |
40 |
16 |
0.3 |
0.080 |
0.23 |
| FUSB090 |
0.90 |
1.80 |
1.2 |
5.9 |
40 |
16 |
0.6 |
0.070 |
0.18 |
| FUSB110 |
1.10 |
2.20 |
2.3 |
6.6 |
40 |
16 |
0.7 |
0.050 |
0.14 |
| FUSB120 |
1.20 |
2.00 |
0.5 |
-- |
40 |
16 |
0.6 |
0.040 |
0.14 |
| FUSB135 |
1.35 |
2.70 |
4.5 |
7.3 |
40 |
16 |
0.8 |
0.040 |
0.12 |
| FUSB155 |
1.55 |
2.70 |
0.6 |
-- |
40 |
16 |
0.7 |
0.030 |
0.12 |
| FUSB160 |
1.60 |
3.20 |
9.0 |
8 |
40 |
16 |
0.9 |
0.030 |
0.11 |
| FUSB185 |
1.85 |
3.70 |
10.0 |
8.7 |
40 |
16 |
1.0 |
0.030 |
0.09 |
| FUSB250 |
2.50 |
5.00 |
40.0 |
10.3 |
40 |
16 |
1.2 |
0.020 |
0.07
|
IH=Hold current-maximum current at which the device will not trip at 23ºC still air.
IT=Trip current-minimum current at which the device will always trip at 23ºC still air.
V MAX=Maximum voltage device can withstand without damage at its rated current.
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
Pd=Typical power dissipated from device when in the tripped state in 23ºC still air environment.
RMIN=Minimum device resistance at 23ºC.
R1MAX=Maximum device resistance at 23ºC 1 hour after tripping .
Physical specifications:
Lead material: Tin plated copper,24 AWG.
Soldering characteristics: Solderability per ANSI/J-STD 002
Solder heat withstand per IEC 68-2-20
FUSB 120 :Test Tb, method 1a, condition a; can withstand 5 second at 260ºC ±5ºC
All others: Test Tb, method 1a, condition a; can withstand 10 second at 260ºC ±5ºC
Insulating coating:Flame retardant epoxy polymer ,meets UL 94V-0 requirement. |
FUSB Product Dimensions (Millimeters)
 |
Lead Size :24AWG,
Ø 0.51 mm Diameter |
Lead Size : 24AWG,
Ø 0.51 mm Diameter |
|
PartNumber |
Fig |
A
|
B
|
C
|
D
|
E
|
F |
|
Maximum |
Maximum |
Typical |
Minimum |
Maximum |
Typical |
| FUSB075 |
2 |
6.9 |
11.4 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB090 |
1 |
7.4 |
12.2 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB110 |
1 |
7.7 |
14.2 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB120 |
2 |
6.9 |
11.7 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB135 |
1 |
8.9 |
13.5 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB155 |
2 |
6.9 |
11.7 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB160 |
1 |
8.9 |
15.2 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB185 |
1 |
10.2 |
15.7 |
5.1 |
7.6 |
3.0 |
0.8 |
| FUSB250 |
1 |
11.4 |
18.3 |
5.1 |
7.6 |
3.0 |
0.8
|
|
Thermal Derating
Curve
 |
|
Typical Time-To-Trip at 23ºC
| A =FUSB075 |
B = FUSB090 |
C = FUSB110 |
D = FUSB120 |
| E = FUSB135 |
F = FUSB155 |
G = FUSB160 |
H = FUSB185 |
| I = FUSB250
|
Part Builder and Ordering Information
| | | | |
|
**Specifications subject to changes**
[Go to Search] [Back]
|
0 Item
