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FAM Series |
END-STACKABLE TYPE
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Features
End stackable for standard 0.1" intergrated circuit pitch.
Molded 0.3" integrated circuit packing outline alloweing automatic insertion.
Smaller size make better heat convection during PC board wave soldering.
Top tape sealed to withstand wave soldering, board washing.
All materials are UL 94V-0 grade fire retardant plastics.
Twin contact designed to ensure stable contact.
Gold plated contact to ensure low contact resistance and tin plated terminal to prevent contamination during soldering.
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Electrical Characteristics
Contact Rating |
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Switching |
25mA, 24VDC |
Non-switching |
100mA, 50VDC |
Contact Resistance |
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Initial |
50m ohm MAX. |
After life test |
100m ohm MAX. |
Insulation Resistance |
1,000M ohm MIN. at 100VDC |
Dielectric strength |
500VDC for 1 minute |
Capacitance between adjacent switches 5pF Max. |
Mechanical and Environmental Characteristics
Temperature Rating |
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Operating |
-25oC to +70oC |
Storage |
-40oC to +85oC |
Operating Force |
800g Max. |
Operating Life |
2,000 Operations. |
Humidity |
95% RH, 40oC for 96 Hrs. |
Vibration |
Per MIL-STD-202F, Method 204D |
Solderability |
After flux 230 ± 5oC for 5 ± 0.5 second 95% coverage. |
Soldering Heat |
After 260 ± 5oC for 5 ± 1 second. |
Dimensions, Construction & Circuitry
Positions | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 12 |
A |
2.5 (0.098) |
5.04 (0.198) |
7.58 (0.298) |
10.12 (0.398) |
12.66 (0.498) |
15.20 (0.598) |
17.74 (0.698) |
20.28 (0.798) |
22.82 (0.898) |
25.36 (0.998) |
30.43 (1.198) |
Unit: mm (inch)
Part Numbering System:
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FAM |
1 |
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08 |
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L |
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Series |
Contact Form |
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Number of Positions |
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Actuator, Sealing, & Row Spacing |
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FAH |
SPST |
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2 4 6 8 10 12 |
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L = Low Profile Actuator & row spacing 8.50mm
L01 = Low Profile Actuator & row spacing 7.62mm
E = Extended Profile Actuator & row spacing 7.62mm
E01 = Extended Profile Actuator & row spacing 8.50mm
LT = Top Tape Sealed, Low Profile Actuator & Pin out 8.50mm
LT01 = Top Tape Sealed, Low Profile Actuator & Pin out 7.62mm
(NOTE: L & E are Standard) |
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**Specifications subject to changes**
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