Stamped Single Beam Contact Closed Bottom DIP Sockets Non-wicking, closed bottom design gives protection against flux and solder contamination Protected open entry for easy insertion of IC's by hand or by automatic insertion Anti-overstress design protects contacts, helps eliminate damage from oversize leads and maintains consistent normal force High normal force results in gas tight connections Recognized under the Component Program of Underwriters Laboratories, Inc. File No. E111362

300c Series

Stamped Dual Wipe Contact DIP Sockets Closed bottom prevents solder wicking Standoff's facilitate board cleaning Low profile design Recognized under the Component Program of Underwriters Laboratories, Inc. File No. E111362

500 Series

DIP Socket with Four-Fingered Contact & Solid Insulator Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion Machined (Premium Series) and stamped (Economy Series) contacts are available "X" & "Y" stackable Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination. Choice of solderless wrap or PC termination Accommodates 6 through 40 pin DIPS, rectangular or round leads Recognized under the Component Program of Underwriters Laboratories, Inc. file no. E111362 Beryllium copper inner contact for maximum mechanical and electrical performance

700 Series

Four-Fingered Contacts Disposable Carriers Easy solder joint inspection-easy cleaning-easy repair “X” & “Y” stackability for circuit flexibility and optimum use of PCB real estate Gang insertion of socket pins into PC boards 100% non-wicking of flux and solder Standard or low profile PC board mounting Availability in 6 to 40 positions on .100"(2,54) centers and a wide variety of row spacing Machined (Premium Series) and stamped (Economy Series) contacts are available

800 Series

Four-Fingered Contact Open Insulator DIP Sockets Precision four-fingered inner contacts provide concentric funnel entry for easy flat and round lead insertion “X” & “Y” stackable. Open ladder for cooling, cleaning and inspection. Low profile Accommodates 8 through 64 pins DIPS, rectangular or round IC leads Non-wicking, closed bottom sleeve provides 100% protection against flux and solder contamination. Choice of solderless wrap or PC termination Recognized under the Component Program of Underwriter Laboratories, Inc. File No. E111362 Beryllium copper inner contact for maximum mechanical and electrical performance Machined (Premium Series) and stamped (Economy Series) contacts are available

2400 Series

Shrink DIP Sockets (.070 Pitch) Sleeve body incorporated in socket reduces the risk of solder bridging during wave solder Open ladder design to permit device cooling Open ladder design makes available additional space within socket for component placement Non-wicking, closed bottom, machined sleeve protects 100% against flux or solder contamination Concentric funnel entry for easy insertion of flat or round IC leads Recognized under the Component Program of Underwriters Laboratories, Inc. File No. E111362

DS Series

Capacitor Socket With Four-Finger Contact Available in three lead termination styles, .125" (3,18) PC tail, .180" (4,57) PC tail and 3-level solderless wire wrap Reduces PCB utilized space by 12% to 15% Allows handling, inventory and installation of one component instead of two Available in three capacitor values: .01mF, .10mF and .33mF Optional assignment of voltage and ground available for custom decoupling requirements, consult factory